Polo Tecnológico Rosario strengthens Latin American innovation ties
/Tecnopuc_and_Polo_Tecnol_gico_MoU_signing.png)
Polo Tecnológico Rosario (Argentina), a recent addition to the IASP network, begun building new connections with fellow IASP members across Latin America, with a series of cooperation agreements and initiatives supporting knowledge exchange and collaboration between innovation ecosystems.
Polo Tecnológico recently welcomed a delegation from Tecnopuc (Brazil), as the two IASP members work towards a formal collaboration agreement between their innovation ecosystems. The visit provided an opportunity to exchange experiences around the construction of "Pactos por la Innovación" (Innovation Pacts), a model that Polo Tecnológico has been actively working on in Rosario.
During the visit to Argentina, representatives from Tecnopuc and Porto Alegre, Jorge Audy and Luiz Carlos Pinto Silva, exchanged experiences and toured Polo Tecnológico Rosario's facilities, Parque de Innovación de Buenos Aires and Parque Empresarial Austral. Discussions focused on new opportunities for linkage and cooperation between the two innovation ecosystems, building on the shared interests of the innovation communities.
A key outcome of the visit was progress towards the signing of a collaboration agreement meant to strengthen the relationship between the two cities and create opportunities for their innovation and technology communities.
In addition to the Brazilian-Argentinian connection, Polo Tecnologico also signed a mutual cooperation agreement with Ciudad del Saber (Panama). Conversations between both parks started with Janelle Castrellón in connection with her role as IASP Latin American division President. The agreement opens the door to initial joint initiatives, including soft landing programmes to support companies from each ecosystem in accessing new markets.
The developing relationship between Rosario and Porto Alegre reflects this role of innovation spaces as connectors within and across regions. Rather than operating in isolation, science and technology parks and other areas of innovation can use international networks like IASP to extend access to knowledge, expertise and potential partners.


.jpg?rev2)
__Jorge_Audy_(Tecnopuc)__Guillermo_Civetta_(Polo_Tecnol_gico)__and_Luiz_Carlos_Pinto_(Tecnopuc).jpg)
.jpg?rev2)
/canvascolor(0xffffffff)/2026_07_16_Netherlands_High_Tech_Campus_Eindhoven.png)
/canvascolor(0xffffffff)/buildings2_7.png)
/canvascolor(0xffffffff)/logo_TROKUT_Å_ibenik_PNG_2.png)
/canvascolor(0xffffffff)/Logo_(1).png)
/canvascolor(0xffffffff)/2024_05_28_Spain_Fundac_on_PTS_Granada.jpg)
/canvascolor(0xffffffff)/2025_01_30_The_Netherlands_Noviotech_campus.png)
/canvascolor(0xffffffff)/2020_09_24_Turkey_Teknopark_Istanbul.png)
/canvascolor(0xffffffff)/MemberLogo-5751-6208.jpg)
/canvascolor(0xffffffff)/2017_08_07_Pando.png)
/canvascolor(0xffffffff)/ZICER_Logo.jpg)
/canvascolor(0xffffffff)/2024_04_04_The_Netherlands_Lindholmen_Science_Park.jpg)
/canvascolor(0xffffffff)/2025_03_04_Germany_Ostfalen.png)
/canvascolor(0xffffffff)/PNG_logo_DDI_seul_en_couleur_3.png)
/canvascolor(0xffffffff)/ODTU_TEKNOKENT_logo_2016.png)
/canvascolor(0xffffffff)/logo_2_(para_rodape_)_1.png)
/canvascolor(0xffffffff)/2024_12_10_Canada_Entreprendre_Sherbrooke_Logo.png)
/canvascolor(0xffffffff)/2019_11_22_India_IKP.jpg)
/canvascolor(0xffffffff)/2018_01_24_Italy_Kilometro_Rosso.png)
/canvascolor(0xffffffff)/logo2024TV.png)
/canvascolor(0xffffffff)/2023_01_27_Lithuania_Tech_Park_Kaunas.png)
/canvascolor(0xffffffff)/MemberLogo-89401-462801.jpg)
/canvascolor(0xffffffff)/WMV_logo_PNG_2024-03-03_14_03_12_1.png)
/canvascolor(0xffffffff)/sip_zurich_rgb_transparent_1.png)
/canvascolor(0xffffffff)/TechFactory_Logo_RGB_primaer_2.jpg)
/canvascolor(0xffffffff)/2023_07_27_Italy_Road_2.jpg)
